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DETAILS
White polyimide label tape is a high temperature coated polyimide material used for die-cut and printed barcode ID and tracking labels.
White thermal transfer polyimide tape can be die cut to meet your specific high-temperature labeling applications. Polyimide label substrates are known for their high heat resistant ability and are also sometimes referred to by the trade name KAPTON. Polyimide has the ability to perform well in temperature ranges up to 400 degrees C. Polyimide labels have a very specific usage in harsh environments that would melt or destroy other types of labels. Also, our custom polyimide label material is lead-free, meeting all the requirements of RoHS and REACH. All of the material that comprises our polyimide labels are thermal transfer printable, and when using the correct ribbon still continue to display resistance to high heat, even in reflow and solder wave environments as experienced when identifying printed circuit boards (PCB).
Specifications
Product Number | White Polyimide Backing Thickness | Adhesive | Total Thickness Mils | Adhesion to Steel oz/in | Dielectric Strength Total Volts | Surface |
CGSTAPE -7858(1mil) | 1 Mil | Acrylic | 2.5 | 25 | 6500 | Matt/Glossey |
CGSTAPE-7858(2mil) | 2 Mil | Acrylic | 3.5 | 25 | 11000 | Matt/Glossey |
APPLICATIONS
PCB High Temperature Labels
Printed Circuit Boards (PCBs) are used to hold and connect electronic components and are found inside every electronic device. They are assembled in an automated process, where they are exposed to extreme heat and chemicals. During assembly, traceability of the PCB is vital– and this requires the use of identification and tracking labels. They maintain their physical integrity, and excellent heat-resistant topcoats ensure that tags remain legible when exposed to extreme temperatures and chemicals. Identification and tracking labels are integral parts of the PCBs used in computers, telecommunications equipment, consumer electronic goods, industrial equipment, medical instruments, automotive systems, military systems and aerospace engineering.