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1mil MT Polyimide Film  ( CGS-7258MT )

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DESCRIPTION:

CGS-7258MT Polyimide film: Its thermal conductivity properties make it ideal for use in dissipating and managing heat in electronic assemblies, such as printed circuit boards.
APPLICATIONS:
• Insulation Pads (Heat Sink)
• Heater Circuits
• Power Supplies
• Ceramic Boards Replacement
 

Main Specifications
ITEM UNITS VALUES
  Thickness mil 1.0
  Thickness Tolerance % +/- 10
  Length m ≥300
  Tensile Strength (Mpa)   MD ≥135
TD ≥110
  Elongation  (%)   ≥ MD ≥40
TD ≥40
  Insulation Strength V/mil ≥ 4200
  Surface Resistivity Ohm/s.q.m ≥1.0x1016

   Volume Resistivity 

Ohm.cm ≥1.0×1016
  Dielectric Constant   < 3.9
  Thermal Conductivity W/m.k 0.36

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